The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Apr. 28, 2000
Thomas Alan Degenkolb, Noblesville, IN (US);
Darrel Eugene Peugh, Kokomo, IN (US);
Bruce Alan Myers, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A combination circuit board ( ) and segmented bus structure ( ) defines a composite circuit board/bus assembly ( ) upon which an electrical circuit may be assembled. The various segments ( ) of bus structure ( ) may be variously configured to achieve one or more assembly, performance, testing, and/or reliability goals. For example, one bus segment configuration provides integral connector tabs ( and ) for mechanical and/or electrical connection to interconnecting wires or electrical terminals of one or more external devices. Another bus segment configuration ( ) provides for mechanical and high current electrical interconnections between one or more bus segments ( ) and one or more electrical components ( ) and/or conductive film patterns( ) formed on top surface ( ) of the circuit board ( ). Still another bus segment configuration provides integral tabs ( and ) for electrical connection to and mechanical attachment of electrical components ( ) from one or more of such tabs ( and ) extending through the circuit board ( ) to other such tabs ( and ) or other circuit structures. Yet another bus structure ( ) provides for highly efficient heat sinking capability and/or electrical connection for electrical components ( ) mounted either directly to one or more bus segments ( ) and for electrical components ( ) mounted to a substrate ( ) that is itself mounted directly to one or more bus segments ( ).