The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2003

Filed:

Nov. 21, 2001
Applicant:
Inventors:

Shigeru Tsuzuki, Osaka, JP;

Kunihiro Fujii, Osaka, JP;

Masahiro Takada, Osaka, JP;

Satoshi Matsuo, Kyoto, JP;

Takafumi Koga, Osaka, JP;

Kozo Murakami, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 ; H03H 9/25 ;
U.S. Cl.
CPC ...
H03H 9/10 ; H03H 9/25 ;
Abstract

A SAW element ( ) is formed of a piezoelectric substrate ( ), on which are provided IDT electrodes ( ), connection electrodes ( ), underlying metal layers ( ), and acoustic materials ( ) placed on the underlying metal layers ( ) and having surfaces parallel to the main surface of the piezoelectric substrate ( ). The SAW element is mounted in a package ( ), which is provided with external terminals ( ) connected with the connection electrodes ( ), and the package is hermetically sealed with a lid ( ) to form a SAW device. When such a SAW element ( ) is mounted faceup in a package ( ) using a vacuum chuck ( ), its piezoelectric substrate ( ) can be protected against damage. When a SAW element ( ) provided with bumps ( ) on its connection electrodes ( ) is mounted facedown in a package ( ), the failure of electrical connections can be prevented.


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