The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Sep. 17, 1999
Kazuo Nishiyama, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side. A mounting method and mounting structure having land terminals arrayed on a printed circuit board or substrate with the same arrangement as the area terminals of the semiconductor component, and the land terminals are connected with the area terminals by a conductive bonding agent.