The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Sep. 06, 2000
Yoshizumi Sato, Yokohama, JP;
Kenji Sasaoka, Machida, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A ground pattern ( ) and power supply pattern ( ) which are formed on the surface of a printed wiring board ( ) are connected to a ground layer ( ) and power supply layer ( ) formed as the internal layers via bumps ( ). The ground pattern ( ) need not be connected to the ground layer ( ) by uniformly plating the inner side surface of a cavity ( ), contributing to an increase in yield and a decrease in cost. When a power supply pattern ( ) is to be connected to a power supply layer ( ) using through holes, the power supply pattern ( ) must be spaced apart from signal pins ( ) detouring the region where the through holes are to be formed. However, the distance between the power supply pattern and the signal pins can.be reduced by using bumps. The distance between a semiconductor chip ( ) and the signal pins ( ) can be reduced to improve the electrical characteristics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile