The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Nov. 14, 2001
Masaaki Irie, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of manufacturing semiconductor chips includes adhering a sheet that is to be tensioned to a reverse side of a semiconductor wafer on a front side of which an integrated circuit has been formed; separating individual semiconductor chips from the semiconductor wafer by dicing the semiconductor wafer from the front side along dicing lines; applying a sealing resin layer of an uncured sealing resin on upper surfaces of the semiconductor chips and in gaps between adjacent semiconductor chips, with the individual semiconductor chips joined by the sheet, thereby sealing the semiconductor chips; and tensioning the sheet, thereby dividing the uncured sealing resin layer into separate pieces along the dicing lines.