The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Feb. 22, 2001
Ming-Tung Shen, Taipei City, TW;
Other;
Abstract
In a method of fabricating an integrated circuit chip, a circuit board unit is formed with a bore, a plurality of contact pads, and a plurality of positioning notches that correspond to the contact pads. A die is attached to a bottom surface of the circuit board unit, and solder pads on the die are wire-bonded to the contact pads using conductive wires that extend through the bore. Leads of a lead frame are inserted respectively into the positioning notches and are bonded to the contact pads. A plastic protective layer is then formed to encapsulate the circuit board unit and at least a portion of the lead frame.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile