The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Oct. 29, 2001
Junichiro Oishi, Tokyo, JP;
Noriyuki Kubota, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus ( ) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp ( ) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion ( ) imparts a wire gripping force to the wire clamp. An elastic sack-like member ( ) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion ( ) through a tube ( ), to thereby generate a wire gripping force.