The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Jan. 18, 2001
Chun Zhang, Tallahassee, FL (US);
Zhiyong Liang, Tallahassee, FL (US);
Ben Wang, Tallahassee, FL (US);
Chiang Shih, Tallahassee, FL (US);
Florida State University Research Foundation, Tallahassee, FL (US);
Abstract
A system for in-situ and on-line monitoring of a preform layup process for liquid composite molding allows for gathering of permeability measurements of a fabric preform for use in a liquid composite molding process after situation of the preform within the mold wherein the molding process is to occur. The system uses a plurality of pressure sensors located within one of the mold sections of the liquid composite molding process mold. The sensors take pressure measurements which are processed to obtain a permeability profile of the preform. From such data, any local permeability variations that are caused from defects in the preform, deformation of the preform, or from mold misfit can be noted and acted upon before resin flow. The system is relatively simple to use and is easy to implement.