The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2003

Filed:

Jun. 30, 2000
Applicant:
Inventors:

David J Mazzarese, Warren, MA (US);

George E Oulundsen, Belchertown, MA (US);

Joseph T Sledziewski, Jr., Warren, MA (US);

Assignee:

Fitel USA Corp., Norcross, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 3/7018 ;
U.S. Cl.
CPC ...
C03B 3/7018 ;
Abstract

The refractive index profile of a multimode optical preform, fabricated by MCVD for example, is modified in the longitudinal direction by removing selected amounts of core material from the wall of a central hole through the preform prior to collapse. The amount of core material to be removed is determined by measuring the refractive index profiles of optical fibers drawn from a number of precursor preforms at various locations along the length of the drawn fibers, averaging their profiles, and then comparing those averages with a desired profile. The refractive index profile is indirectly measured by bandwidth measurements, which are related to the alpha value a selected parameter (e.g., bandwidth) at various locations along the length of a fiber drawn from a previously fabricated preform. This parameter is then compared with desired values of that parameter at the various locations, and the differences are used to calculate the amount of core material that needs to be removed. Selective core material removal is accomplished by moving a torch along the length of the preform and flowing an etchant gas, such as a mixture of oxygen and SF , through the central hole in the preform. Selective etching is accomplished by varying the flow rate and/or the concentration of the etchant gas and/or the torch speed as a function of the location of the torch along the length of the preform.


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