The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Apr. 18, 2002
Masako Tanaka, Suwa, JP;
Takashi Endo, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A package has a first region and a second region on one principal plane, and has a base including a ceramic board where wiring patterns to connect a quartz crystal resonator element and an IC chip for its driving are formed. In the base, a first sidewall enclosing the first region is arranged on the top side of the board, and the quartz crystal resonator element is mounted in a first void space delimited in its internal, and the IC chip is mounted in a second void space delimited by a second sidewall enclosing the second region. The first sidewall is formed to be higher than the second sidewall, a metal cover is seam welded at the upper end thereof, and the first void space is sealed in a vacuum or nitrogen atmosphere. The IC chip of the second region is resin sealed. In addition to the miniaturization, thinning and high-accuracy frequency adjustment, the present invention reduces or eliminates the stray capacity caused by the adsorption of gas that is generated from electronic components and wiring, package/wiring structure, and the like to reduce or prevent the reduction of variable amount of frequency and displays a high frequency stability and aging characteristics. It is particularly suited to a high-frequency oscillator with a large variable amount of frequency.