The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Jun. 19, 2001
Applicant:
Inventors:
Christopher W. Jones, Pleasanton, CA (US);
Andrew J. Wright, Mountain View, CA (US);
Assignee:
Cypress Semiconductor Corp., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/349 ; H01L 2/352 ; H01L 2/348 ; H01L 2/706 ;
U.S. Cl.
CPC ...
H01L 2/349 ; H01L 2/352 ; H01L 2/348 ; H01L 2/706 ;
Abstract
A method of fabricating a semiconductor package that may contain two or more dies. The method generally comprises the steps of (A) mounting a first die having a first side on an assembly apparatus and (B) mounting a second die having a second side and an adjoining third side on said assembly apparatus. The second die may be oriented such that (i) the second side and the third side both face the first side and (ii) the second side and the third side are both substantially nonparallel to the first side.