The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2003

Filed:

Nov. 07, 2000
Applicant:
Inventor:

Jochen Gerner, Wiesloch, DE;

Assignee:

Vishay Semiconductor GmbH, Heilbronn, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/715 ;
U.S. Cl.
CPC ...
H01L 2/715 ;
Abstract

A multilayer contact electrode for connecting a bonding wire to a p-type surface of a III/V-compound semiconductor is formed by a first metallizing step followed by a tempering step. Then, a second metallized layer of the same metal as the first metal layer is formed on the first layer but tempering of the second layer is avoided. A reliable bonding of a bonding wire to the non-tempered contact electrode is assured. The contact electrode includes a first inner metallized layer that is tempered and covered by a second nontempered metallized layer of the same metal as the first layer.


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