The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Oct. 19, 2001
Applicant:
Inventor:
Satoshi Nakamura, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 ;
U.S. Cl.
CPC ...
H05K 1/02 ;
Abstract
A circuit substrate ( ) comprises a first substrate split ( ) formed with a predetermined wiring pattern ( ) and a second substrate split ( ) formed with a predetermined wiring pattern ( ). The substrate splits are electrically and/or mechanically joined together, and the circuit substrate is bent at the joint. The joint is provided by a bendable joint member ( ) including a plurality of leads ( ) disposed in parallel and held by a thin piece of base film ( ) integrally therewith. The joint member is attached to interconnect the first and the second substrate splits ( ).