The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Jun. 18, 2001
Applicant:
Inventors:
Hong-Ming Lin, Hsinchu City, TW;
Jin-Chuan Bai, Sanzhong City, Taipei Hsien, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract
A chip photoelectric sensor assembly includes a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor chip is electrically connected with the substrate. The photoelectric sensors of the photoelectric sensor chip are masked by a photosensitive protective layer made of a photosensitive hard coating material. The photosensitive protective layer has a thickness ranging between 1 and 10 microns. The very thin photosensitive protective layer is thus capable of minimizing the light refraction distortion.