The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6531267 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 11, 2003

Filed:

Apr. 11, 2001
Applicant:
Inventor:

Joseph E. Oberlander, Phillipsburg, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/32 ; B01D 3/900 ; B01D 1/500 ; C02F 1/42 ; G21F 9/04 ;
U.S. Cl.
CPC ...
G03F 7/32 ; B01D 3/900 ; B01D 1/500 ; C02F 1/42 ; G21F 9/04 ;
Abstract

Disclosed is a method for producing an acid sensitive liquid composition. The method involves passing an acid sensitive liquid composition containing a carbonate represented by the formula ROC(═O)OR wherein R and R independently are a hydrocarbyl group of 1 to about 10 carbon atoms, through at least one of the following two filter sheets: (a) a filter sheet containing a self-supporting fibrous matrix having immobilized therein a particulate filter aid and a particulate ion exchange resin having an average particle size of from about 2 to about 10 microns, wherein the particulate filter aid and ion exchange resin particles are distributed substantially uniformly throughout a cross-section of said matrix; and/or (b) a filter sheet containing a self-supporting matrix of fibers having immobilized therein particulate filter aid and binder resin, and having an average pore size of about 0.05 to 0.5 &mgr;m. Also disclosed is a method for treating a film of a photoresist composition disposed on a surface, which involves contacting the photoresist composition with an acid sensitive liquid composition prepared by the aforementioned method, in an amount sufficient to produce a substantially uniform film thickness of the photoresist composition across the film surface.


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