The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6530827 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 11, 2003

Filed:

Jan. 05, 2001
Applicant:
Inventor:
Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ;
Abstract

An apparatus for polishing an object, includes (a) a rotatable circular polishing plate ( ) having a polishing surface on which an object ( ) is to be polished, (b) a pressurizer ( ) which applies a pressure to an object ( ) to make the object ( ) contact with the polishing surface, (c) a first unit ( ) which supplies polishing solution containing abrasive, to the polishing surface, (d) a dresser ( ) which dresses the polishing surface, and (e) a second unit ( ) which is located downstream of the dresser ( ) and upstream of the first unit ( ) in a direction of rotation of the polishing plate ( ) and which has an absorption surface ( ) through which the second unit sucks the polishing solution from the polishing surface, the absorption surface ( ) being formed thereon with a plurality of pivots ( ).


Find Patent Forward Citations

Mitsuhashi, Masashige. (2003). Apparatus for polishing wafer and method of doing the same (U.S. Patent No. 6530827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6530827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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