The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2003

Filed:

Oct. 24, 2001
Applicant:
Inventors:

Ren-Chih Li, Tu-Chen, TW;

Jwomin Wang, Hsin-Dan, TW;

Yao-Chi Huang, Yung-Ho, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/3625 ;
U.S. Cl.
CPC ...
H01R 1/3625 ;
Abstract

A ball grid array socket connector ( ) includes an insulative base ( ), a number of conductive contacts ( ) fixed to the base, a number of solder balls ( ) attached to tail portions ( ) of corresponding contacts and a cover ( ) movably attached to the base. The base has a top surface ( ), a bottom surface ( ) and defines a number of cavities ( ) through the top surface and the bottom surface. The cavities are arranged in a matrix. The contacts are received in corresponding cavities of the base. The base provides a number of stand-offs ( ) which downwardly protrude from the bottom surface of the base and terminate at a plane (D) generally parallel with the bottom surface of the base. The solder balls each have a bottom tip ( ) that downwardly extends beyond the plane D. The base defines a number of notches ( ) in the bottom surface thereof. The notches are located at outer sides of the matrix of cavities.


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