The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Jun. 12, 2001
Applicant:
Inventor:
Hiroshi Kawashimo, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/704 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/704 ; B23K 3/102 ;
Abstract
A wire bonding apparatus for connecting a metal fine wire at a normal position on a bonding pad of an IC chip so that there will be no variations in the positions of a die pad and the IC chip at the time of bonding. A platen is disposed on a heat block in accordance with the shape of an IC lead frame for enlarging a heat transfer surface for transferring heat to the lead frame. A heater and a preheater for preheating an IC chip that is to be heated next by the heater are disposed on a surface of the platen.