The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Dec. 20, 2000
Hyun-Chae Song, Inchonkwangyokshi, KR;
Tae-Hyung Rhee, Kyonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
Disclosed is a method for formatting facets of an optical waveguide element. The method according to the present invention includes the steps of: (1) attaching auxiliary blocks so they are protruded from the upper portions of both ends of the optical waveguide element by a means of an adhesive coupling, and coating with the adhesive from the bottom of the protruded auxiliary blocks to the end facets of the core and the cladding layer of the optical waveguide element; (2) contacting the auxiliary blocks with a thermal plate, which has undergone an optical facial treatment, so that the facets of the optical waveguide element, including the auxiliary blocks formed in the first step can be shaped into a predetermined oblique angle; (3) applying pressure on the optical waveguide element including the auxiliary blocks in a downward direction against the thermal plate until the adhesive coated on the facets of the optical waveguide element is completely melted; (4) moving the optical waveguide element including the auxiliary blocks in a horizontal direction along the thermal plate at the moment when the adhesive coated on the facets of the optical waveguide element including the auxiliary blocks is completely melted; and, (5) removing the optical waveguide element including the auxiliary blocks from the thermal plate at the moment when the adhesive coated on the facets of the optical waveguide element including the auxiliary blocks is completely removed.