The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2003

Filed:

Jun. 29, 1999
Applicant:
Inventors:

Tsutomu Matsuhira, Chiba, JP;

Atsushi Endo, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/312 ;
Abstract

An electronic circuit device has an insulating substrate and an integrated circuit having a surface disposed opposite to and confronting a surface of the insulating substrate to form a gap therebetween. An adhesive material is disposed in the gap between the insulating substrate and the integrated circuit. Bumps project from the surface of the integrated circuit towards the surface of the insulating substrate. Electrode patterns are electrically connected to the bumps to electrically connect the integrated circuit to the electrode patterns. An adhesion-reinforcing pattern is spaced-apart from and surrounded by the electrode patterns. The adhesion-reinforcing pattern is disposed on a portion of the surface of the insulating substrate confronting a portion of the surface of the integrated circuit from which the bumps do not project.


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