The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Mar. 29, 2001
Applicant:
Inventors:
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Shigeaki Mashimo, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Assignee:
Sanyo Electric Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/306 ; H01L 2/348 ; H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/306 ; H01L 2/348 ; H01L 2/328 ;
Abstract
A semiconductor device is provided wherein conductive paths formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin and the back surface of the conductive path is exposed through the insulating resin and sealed. With this arrangement, fractures of the conductive paths embedded in the insulating resin are suppressed.
Sakamoto, Noriaki. (2003). Semiconductor device and semiconductor module (U.S. Patent No. 6528879). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6528879
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile