The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Aug. 08, 2001
Georg Ernst, Thalmassing, DE;
Thomas Zeiler, Regensburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor component includes a chip carrier having a first surface, a second surface, and openings therein. At least one semiconductor chip is mounted on the chip carrier. Soldering connection points are formed by at least one metal foil that lines the openings and that extends through the openings. Contact-making points are connected to the semiconductor chip and form electrically conductive connections which extend through the openings in the chip carrier to the soldering connection points. A further metal foil is located between the semiconductor chip and the chip carrier and forms a soldering connection point. The openings include at least one opening that is located underneath the semiconductor chip. The further metal foil extends through the opening that is located underneath the semiconductor chip to the first surface and to the second surface.