The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6528757 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 04, 2003

Filed:

May. 30, 2001
Applicant:
Inventor:

Takehiko Takahashi, Yamagata, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 2/638 ;
U.S. Cl.
CPC ...
B23K 2/638 ;
Abstract

An apparatus processing a gate portion in a semiconductor manufacturing apparatus includes a laser beam scanner unit and a cutter. The laser beam scanner unit is disposed along a carrying line on which a lead frame is carried. The laser beam scanner unit has an optical scanner unit second-dimensionally scanning laser beams, and a lens unit collecting the laser beams. The cutter has a punch. The punch mechanically pushes to cut a gate correspondence portion which is perfectly cut away or almost cut away from a semiconductor package body by the laser beams.


Find Patent Forward Citations

Takahashi, Takehiko. (2003). Apparatus processing a gate portion in a semiconductor manufacturing apparatus, which remove a gate correspondence portion from a semiconductor package connected to a lead frame, and a resin burr deposited on a lead portion associated with the semiconductor package (U.S. Patent No. 6528757). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6528757

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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