The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2003

Filed:

Oct. 06, 2000
Applicant:
Inventors:

Luc Petit, Fontaine, FR;

Alexandre Castellane, Colombe, FR;

Assignee:

STMicroelectronics S.A., Gentilly, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

Process for producing electrical-connections on a semiconductor package containing an integrated-circuit chip and with an external protective layer having apertures that least partly expose metal electrical-connection regions, and semiconductor package provided with such metal electrical-connections. The apertures having walls are filled with a metal electrical-connection layer covering at least their walls. A metal solder drop is soldered to the connection layer so that it is not in contact with the external protective layer.


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