The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Sep. 20, 2000
Photosensitive resin composition, multilayer printed wiring board and process for production thereof
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Abstract
The invention provides an photosensitive resin composition excellent in heat resistance and adhesion to wiring layers which yields high resolution after development with aqueous solution containing no organic solvent. The composition is used as an adhesive between circuits in a process producing a multi-layer printed wiring board by a built-up method. The composition comprises a compound (A) having the molecule at least one phenolic hydroxyl group and at least one acryloyl or methacryloyl group, an unsaturated imide compound (B), a photopolymerization initiator (c) and, optionally, an epoxy compound (D) having at least two epoxy groups in the molecule. Also, provided for is a multilayer printed wiring board comprising wiring layers and insulating layers, which are alternatively formed wherein said insulating layers are formed of said composition.