The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Mar. 07, 2000
Applicant:
Inventor:
Donald K. Harper, Jr., Harrisburg, PA (US);
Assignee:
FCI Americas Technology, Inc., Reno, NV (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/3625 ;
U.S. Cl.
CPC ...
H01R 1/3625 ;
Abstract
A modular construction of connectors is provided for reducing the effects of the differential coefficient of thermal expansion of the connectors and the underlying circuit board. Each connector of the modular construction is mounted on a known circuit board or the like and could receive therein an integrated circuit chip carrier or could mount to another board. The principle of solder surface tension and self-centering characterized in ball grid array (BGA) surface mount technology is used to form an array connector having multiple components that form a larger array pattern or group of arrays.