The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Jul. 19, 2001
Makoto Totani, Kariya, JP;
Toshihiro Miyake, Inuyama, JP;
Tomohiro Yokochi, Obu, JP;
Takehito Teramae, Chiryu, JP;
Yoshitaro Yazaki, Anjo, JP;
Kazuyuki Deguchi, Inabe-gun, JP;
Hajime Nakagawa, Aichi-gun, JP;
Denso Corporation, Kariya, JP;
Abstract
Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.