The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2003

Filed:

Nov. 16, 2000
Applicant:
Inventors:

Eun Hyoung Seong, Seoul, KR;

Tae Sung An, Kyoungki-do, KR;

Chan Ho Park, Choongchungnam-do, KR;

Assignee:

Mirae Corporation, Choongchungnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 ;
U.S. Cl.
CPC ...
G01R 1/04 ;
Abstract

A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and having one or more coupling portions, a plurality of plates provided at one side of the air jet body, and a cover provided at the other side of the air jet body. Since the cooling system rapidly cools the heated module IC, the number of module ICs that fail can be reduced, thus resulting in an improvement in the reliability of the products.


Find Patent Forward Citations

Seong, Eun. (2003). Cooling system for a module ic handler (U.S. Patent No. 6525527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6525527

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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