The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2003
Filed:
Aug. 24, 2000
Applicant:
Inventor:
Nobuyuki Matsuo, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A heat radiation structure of a mold package for a semiconductor device. The heat radiation structure includes an island of a lead frame having a high heat conductivity for mounting a semiconductor device; outside leads having a high heat conductivity and extending outwardly from the island; and at least a connective region having a high heat conductivity for electrically and thermally connecting the island to the outside leads.