The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2003
Filed:
Jan. 12, 2001
Applicant:
Inventors:
Hideki Goda, Kyotanabe, JP;
Tetsuji Higashino, Osaka, JP;
Assignee:
Arakawa Chemical Industries Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 6/5336 ;
U.S. Cl.
CPC ...
C08G 6/5336 ;
Abstract
The present invention provides an epoxy resin composition which comprises an alkoxy-containing silane-modified epoxy resin (A) which is obtainable by dealcoholization condensation reaction between a bisphenol epoxy resin ( ) and hydrolyzable alkoxysilane ( ); and a curing agent (B) for epoxy resin. The present invention also provides a method for preparing an alkoxy-containing silane-modified epoxy resin, the method comprising dealcoholization condensation reaction between the bisphenol epoxy resin ( ) and the hydrolyzable alkoxysilane ( ).