The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2003
Filed:
Jun. 14, 2000
Applicant:
Inventors:
Yoichiro Tsuji, Ichihara, JP;
Kenji Iwamasa, Ichihara, JP;
Assignee:
Mitsui Chemicals, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/904 ;
U.S. Cl.
CPC ...
B29C 4/904 ;
Abstract
A method for manufacturing a hollow molded article by extruding a parison of an ethylene/&agr;-olefin copolymer whose density, melt flow rate, melt tension, decane soluble matter content and melting point are controlled within particular ranges, while controlling the resin pressure in the extruder within a certain range, and then blow-molding such parison. This method makes it possible to improve the drawdown characteristic of the parison and to provide a container showing high mechanical strength and only a small amount of extraction into the contents of the article.