The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2003
Filed:
Sep. 07, 2001
Steven L. Flickinger, Hummelstown, PA (US);
William Herb, Harrisburg, PA (US);
William E. Veith, Hershey, PA (US);
Harold W. Kerlin, Port Royal, PA (US);
Edward J. Bright, Middletown, PA (US);
Dennis L. Kemmick, Columbia, PA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
A receptacle for receiving a module and electrically connecting said module to a host circuit board mounted within a chassis of a host system, said chassis having a bezel opening which has an offset a certain distance above said host circuit board: (a) a housing having a front, a back wall, a top wall, a bottom wall, and side walls and defining a cavity for receiving a module, the bottom wall having a bottom opening to receive a receptacle connector, the front having a front opening to receive the module, the walls comprising a conductive material; (b) a plurality of elongated members extending down from the housing past the bottom wall and adapted for electrical connection to a host circuit board such that the walls are electrically connected to the host circuit board; and (c) at least one standoff extending down from the housing, the standoff being more toward the front of the housing than the rear, when the housing is mounted to the host circuit board, the standoff contacts the circuit board and causes the front of the housing to be raised above the rear of the housing, the front of the housing being raised above the host circuit board by a distance approximately the same as that of the offset.