The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2003

Filed:

Sep. 20, 2001
Applicant:
Inventors:

Koichi Sakaguchi, Osaka, JP;

Shinjiro Domi, Osaka, JP;

Shigeki Nakagaki, Osaka, JP;

Yoshikazu Toshikiyo, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract

A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to be bonded, (B) mechanically abrading portions of the respective bonding faces contacting the bonding material to be bonded to each other, (C) setting the respective objects fixed in a predetermined position relative to each other while maintaining the respective objects in contact with the bonding material in the fluid state thereof, and (D) solidifying the bonding material to bond the respective objects to each other. In the respective steps (A)-(D), the bonding material is present at the bonding portions to be bonded to each other of the respective objects constantly and without discontinuities.


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