The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2003
Filed:
Nov. 07, 2000
Takao Matsumoto, Tokyo, JP;
Takeshi Wada, Tokyo, JP;
Atsushi Hirose, Tokyo, JP;
Mitsuyoshi Kawai, Tokyo, JP;
Masashi Shiraishi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A method of mounting an IC chip on a suspension having connection pads. The IC chip has a circuit for a thin-film magnetic head element and connection terminals connected to the circuit. The method includes a step of increasing a load applied to the IC chip so that metal bumps formed on the connection terminals press the connection pads formed on the suspension, respectively, and a step of starting application of the ultrasonic vibration to the IC chip during the increasing of the load applied to the IC chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile