The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Dec. 28, 1999
Wesley R. Erck, Danville, CA (US);
Michael R. Magee, Los Gatos, CA (US);
Michael D. Beer, San Jose, CA (US);
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A method and system thereof for maximizing integrated circuit die production. In an example embodiment, the method is implemented on a server computer system in a client-server computer system network. In this embodiment, the server computer system receives from a client computer system a wafer size, a scribe lane width, and the dimensions for a die. A die count and a stepper shot count corresponding to the dimensions are determined using one or more lookup tables. A lookup table is associated with each combination of wafer size and scribe lane width. A measure of die production is calculated using the die count and the stepper shot count and transmitted to the client computer system. The dimensions can be changed and a new measure of die production calculated using the changed dimensions, until a maximum value of the measure of die production is determined.