The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Nov. 27, 2001
Kwon-Young Roh, Seoul, KR;
Dong-Suk Kim, Kyungki-do, KR;
Samsung Electronics Co., Ltd., Hwasung, KR;
Abstract
A semiconductor package comprises a semiconductor chip and a printed circuit board. The printed circuit board comprises a board body. An upper wiring layer is formed on the upper surface of the board body and includes a chip-mounting portion for mounting the semiconductor chip, board pads formed around the chip-mounting portion and electrically connected to said semiconductor chip, and an upper heat dissipation layer around said chip-mounting portion. Further, a lower wiring layer including a lower heat dissipation layer is formed on the lower surface of the board body. First heat-dissipating via holes are formed through the board body between the chip-mounting portion and the lower heat dissipation layer and are filled with a thermally conductive material for dissipating heat from the chip through the board body to the lower wiring layer. Second heat-dissipating via holes are formed through the board body below said upper heat dissipation layer and are filled with a thermally conductive material for dissipating heat generated from the chip through the board body to the upper heat dissipation layer.