The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2003

Filed:

Mar. 23, 2001
Applicant:
Inventors:

Christian Hauser, Regensburg, DE;

Johann Winderl, Wackersdorf, DE;

Jens Pohl, Bernhardswald, DE;

Assignee:

Infineon Technologies AG, München, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

The invention relates to a device and a method for packaging electronic components ( ) having semiconductor chips ( ) by means of a mounting frame ( ), which is additionally provided with a plastic grid ( ) that is disposed on a plastic intermediate substrate ( ), which surrounds each semiconductor chip ( ) in framelike fashion and which for packaging the plurality of semiconductor chips ( ) with a plastic casting composition ( ) between semiconductor chips ( ) and the plastic grid ( ).


Find Patent Forward Citations

Loading…