The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Jun. 26, 2001
I-Ming Chen, Taipei, TW;
Computech International Ventures Limited, Tortola, VG;
Abstract
A method for manufacturing a semiconductor device includes the steps of preparing a semiconductor chip with a plurality of bonding pads and a plurality of conductive bumps on the bonding pads, preparing a substrate formed with a plurality of bump receiving holes and a plurality of conductive traces having contact portions adjacent to peripheries of the bump receiving holes, laying the substrate over the semiconductor chip such that the conductive bumps respectively extend through the bump receiving holes, and forming a plurality of conductive bodies, each of which encloses and electrically connects a top portion of a respective one of the conductive bumps to the contact portion of a respective one of the conductive traces.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile