The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6521466 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 18, 2003

Filed:

Apr. 17, 2002
Applicant:
Inventor:

Paul Castrucci, South Burlington, VT (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; G06F 1/900 ;
U.S. Cl.
CPC ...
H01L 2/100 ; G06F 1/900 ;
Abstract

An improved semiconductor wafer processing system includes defect detection equipment and defect eradication equipment. The defect eradication equipment is a supercritical fluid cleaning apparatus. The defect detection equipment creates a record for each wafer indicating defect identification and characterization results at each wafer processing station. The supercritical fluid cleaning apparatus receives the defect data from the defect detection equipment and applies a defect appropriate supercritical fluid cleaning recipe based on generic cleaning recipes and/or defect specific cleaning recipes. The system further includes equipment for transferring a plurality of semiconductor wafer among a plurality of processing stations under computer control. The improved semiconductor wafer processing system produces IC test yields of the order of 68% and a defect density of 0.1 defects/cm for a 430 mm chip.


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