The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Apr. 04, 2001
Applicant:
Inventors:
Assignee:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/912 ;
U.S. Cl.
CPC ...
H01L 2/912 ;
Abstract
An epoxy resin comprising (A) an epoxy resin, (B) a curing agent and (C) a filler, in which the epoxy resin (A) contains a bisphenol F-type epoxy compound (a), the filler (C) contains spherical silica and the filler (C) accounts for from 88 to 96% by weight of the resin composition, has good soldering heat resistance enough for high-temperature solder reflow and has good moldability. A semiconductor device encapsulated with the resin composition is useful for use in electronic appliances.
Shimizu, Hiroo. (2003). Epoxy resin composition and semiconductor device (U.S. Patent No. 6521354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6521354
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile