The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Dec. 04, 2000
Applicant:
Inventors:
Masayuki Kitajima, Kawasaki, JP;
Masakazu Takesue, Kawasaki, JP;
Yasuo Moriya, Kawasaki, JP;
Yoshinori Nemoto, Kawasaki, JP;
Yumiko Fukushima, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 1/302 ;
U.S. Cl.
CPC ...
C22C 1/302 ;
Abstract
A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
Kitajima, Masayuki. (2003). Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy (U.S. Patent No. 6521176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6521176
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile