The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2003

Filed:

Jun. 02, 2000
Applicant:
Inventors:

Yoshinori Ito, Tokyo, JP;

Emi Yamada, Tokyo, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/573 ;
U.S. Cl.
CPC ...
B29C 4/573 ;
Abstract

There is disclosed a molding die which can prevent or restrain a wedge-like deformation from being formed at an outer peripheral portion of an optical recording disk. The molding die is for molding a thin circular plate optical recording disk by injecting a molten thermosetting resin in a cavity, and an outer peripheral member coming in contact with a portion which becomes an outer peripheral surface of the optical recording disk is made of a material having a thermal conductivity lower than a thermal conductivity of a material of an opposite member coming in contact with a portion which becomes a main surface of the optical recording disk, that is, a stamper, a stationary mirror, and a movable mirror.


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