The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
May. 17, 2000
Ping Chao, Los Altos Hills, CA (US);
Wei-Jin Dai, Cupertino, CA (US);
Mitsuru Igusa, Los Gatos, CA (US);
Wei-Lun Kao, Cupertino, CA (US);
Jia-Jye Shen, Palo Alto, CA (US);
Silicon Perspective Corporation, San Jose, CA (US);
Abstract
Disclosed herein is a method for dividing an integrated circuit (IC) design into several circuit partitions, each including one or more circuit modules, and then separately carrying out placement and routing for each circuit partition, with each partition being implemented within a separate area of an IC substrate. The method initially generates a whole-chip trial placement that tends to cluster cells of each circuit module together. An IC substrate floor plan assigning modules to various partitions is prepared, with the size, shape and relative position of each partition being determined by size, shape and relative position of areas of the substrate occupied by those modules in the trial floor plan. A trial routing is also performed with information on which to base a pin assignment plan for each module. A detailed placement and routing process is then independently performed for each partition, with placement and routing of cells within each partition constrained by the floor plan and pin assignment plan.