The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Nov. 09, 2000
Gil Biran, Raananna, IL;
Yoram Henik, Shoham, IL;
Axerra Networks, Ltd., Tel-Aviv, IL;
Abstract
Alternative structures and backplanes are designed so as to provide for telecom/datacom equipment conforming to either the ETSI standard or NEBS standard with minimum engineering efforts and with minimum changes in the basic parts of the products. ETSI chassis has an upper enclosure region for housing interface modules of the system and a lower enclosure region for housing system modules of the system. When assembled, a backplane is disposed along a common back wall of both enclosures. A portion of the backplane extends into the upper enclosure region from the lower enclosure region and includes connectors for receiving connectors of the interface modules. The portion of the backplane located in the lower enclosure region includes connectors for receiving connectors of the system modules. The NEBS chassis has front and rear enclosure regions for housing system modules and interface modules, respectively, and slots located on the front and rear walls for receiving system modules and interface modules into their respective housing regions. When assembled, a NEBS backplane is disposed along a plane dividing the front and rear regions. The backplane has a surface facing the front enclosure region including connectors for receiving connectors of the system modules and a surface facing the rear enclosure region for receiving connectors of the interface modules. The modules used in the equipment are the same for both structures and backplanes.