The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Oct. 27, 2000
Akira Ichida, Toyama, JP;
Hiroshi Yoshida, Toyama, JP;
Masahiko Mizukami, Toyama, JP;
Yoshihiko Doi, Chiba, JP;
Allied Material Corporation, Tokyo, JP;
Abstract
In a package of a semiconductor device mounted a semiconductor element and micro balls as electric contact points, the micro balls are composed of composite micro balls each of which has a core ball and an electrically conductive film around the core ball. The core balls have a sufficient rolling property with the diameter ranged from 30 to 100 &mgr;m. The diameter accuracy thereof is excellent. The electrically conductive film is formed by a solder plated layer which has a thickness of at least 10 &mgr;m uniformly formed on the outer surfaces. The composite micro balls are mounted onto a substrate. The dimensional accuracy of the Z axis of the package can be precisely controlled. Accordingly, the composite micro balls with the solder plated film has a thickness of at least 20 &mgr;m on the outer circumference of each core ball. The production method thereof, and the semiconductor package mounted a semiconductor element using the composite micro balls can be provided.