The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Mar. 07, 2002
Kimio Yamakawa, Chiba Prefecture, JP;
Kazumi Nakayoshi, Chiba Prefecture, JP;
Hiroki Ishikawa, Chiba Prefecture, JP;
Ryoto Shima, Chiba Prefecture, JP;
Junji Nakanishi, Chiba Prefecture, JP;
Tomoko Kato, Chiba Prefecture, JP;
Minoru Isshiki, Chiba Prefecture, JP;
Katsutoshi Mine, Chiba Prefecture, JP;
Dow Corning Toray Silicone Company, Ltd., Tokyo, JP;
Abstract
A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.