The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Sep. 14, 2001
Applicant:
Inventor:
Fumihiko Hirose, Kanagawa-ken, JP;
Assignee:
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1461 ;
U.S. Cl.
CPC ...
H01L 2/1461 ;
Abstract
According to a method for manufacturing a semiconductor device having a junction boundary where SiGe of a first conductivity type and Si or SiGe of a second conductivity type come in contact with each other, a portion where the junction boundary is exposed on the surface is cleaned with a first solution containing hydrofluoric acid and is then cleaned with a second solution containing sulfuric acid.