The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6518140 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 11, 2003

Filed:

Sep. 28, 2001
Applicant:
Inventors:

Hee-Geun Jeong, Seoul, KR;

Yong-Shik Kim, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1331 ;
U.S. Cl.
CPC ...
H01L 2/1331 ;
Abstract

A defect removable semiconductor element and the manufacturing method thereof are provided with a protective layer covering fuses exposed at a part of the redundancy memory cell region, the layer being thinner than the one covering the main memory cell region, so that a predetermined fuse is cut off for removing a defect without damaging adjacent fuses even if the amount of energy of laser beam to be applied is greater and the size of the spot to be focused is bigger, thereby improving operational conditions in the energy of the laser beam to be applied and the size of a spot to be focused and the operational reliability in removing a defect.


Find Patent Forward Citations

Jeong, Hee-Geun. (2003). Manufacturing methods for defect removable semiconductor devices (U.S. Patent No. 6518140). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6518140

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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