The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2003

Filed:

Mar. 06, 2001
Applicant:
Inventors:

Takao Sakamoto, Niigata, JP;

Shinya Kawamoto, Niigata, JP;

Katsuaki Kotari, Niigata, JP;

Katsuyoshi Kojima, Niigata, JP;

Masayoshi Saitou, Niigata, JP;

Yoshihiko Hoshi, Niigata, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 2/900 ;
U.S. Cl.
CPC ...
B24B 2/900 ;
Abstract

A polishing apparatus which attaches the semi-conductor wafers to the polishing plate for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring provided at the lower end of the guide ring for contacting the polishing cloth, and a weight detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.


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