The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Sep. 14, 2001
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
A method of controlling a wafer polishing time using a sample-skip algorithm and a method of polishing a wafer using the same are provided. According to the method of controlling a wafer polishing time, a chemical mechanical polishing (CMP) process is performed on a plurality of wafers of an n-th lot among a plurality of lots, each lot consisting of a plurality of wafers, for a time &Dgr;t(n), to calculate the amount removed &Dgr;ToxP(n) from a polished layer on the wafer. The removal rate RR (n) of a layer on a blanket wafer is calculated from the amount removed &Dgr;ToxP(n). A CMP time &Dgr;t(n+1) is determined for wafers of an n+1-th lot using the relationship equation &Dgr;t(n+1)={&Dgr;ToxT(n+1)+A}/RR (n) where “A” is a constant and &Dgr;ToxT(n+1) is the target amount of a layer to be removed from a wafer of an n+1-th lot.